MICROCHIP SP1F, SP3F Power Module

Zvinotsanangurwa

• Product: SP1F and SP3F Power Modules
• Muenzaniso: AN3500
• Application: PCB Mounting and Power Module Mounting

Nhanganyaya

Ichi chinyorwa chekunyorera chinopa kurudziro huru yekubatanidza zvakadhindwa redunhu bhodhi (PCB) kune SP1F kana SP3F yemagetsi module uye kukwidza module yemagetsi pane singi yekupisa. Tevedza mirairo yekumisikidza kudzikamisa zvese zvinopisa uye zvema mechanical stress.

PCB Mounting Mirayiridzo

• The PCB mounted on the power module can be screwed to the standoffs to reduce all mechanical stress and minimize relative movements on the pins that are soldered to the power module. Step 1: Screw the PCB to the standoffs of the power module.
  
• Iyo self-tapering plastite screw ine dhayamita yezita re 2.5 mm inokurudzirwa kuti ibatanidze PCB. A plastite screw, inoratidzwa mumufananidzo unotevera, imhando ye screw yakanyatsogadzirirwa kushandiswa nepurasitiki nezvimwe zvinhu zvakaderera-density. Kureba kwescrew kunoenderana nePCB ukobvu. Iine 1.6 mm (0.063”) gobvu PCB, shandisa plastite sikuruu 6 mm (0.24”) kureba. Iyo yakanyanya kukwirisa torque ndeye 0.6 Nm (5 lbf·in). Tarisa kutendeseka kwepurasitiki post mushure mekuomesa screws.
  
• Danho 2: Solder all electrical pins of the power module to the PCB as shown in the following figure. A no-clean solder flux is required to attach the PCB, as the aqueous module cleaning is not allowed.
  

Cherechedza: 

• Usadzorere nhanho mbiri idzi, nekuti kana mapini ese atengeswa kutanga kuPCB, kupuruzira PCB kune standoffs kunogadzira deformation yePCB, zvichitungamira kune kumwe kushushikana kwemagetsi kunogona kukuvadza matinji kana kuputsa zvikamu paPCB.
• Makomba ari muPCB sezvaratidzwa mumufananidzo wapfuura anodiwa kuisa kana kubvisa masiruuru anokwirisa anorovera pasi module yemagetsi kune singi yekupisa. Aya maburi ekupinda anofanira kunge akakura zvakakwana kuti screw head uye washer zvipfuure zvakasununguka, zvichibvumira kushivirira kwakajairwa muPCB gomba nzvimbo. Iyo PCB gomba dhayamita yemapini emagetsi inokurudzirwa pa1.8 ± 0.1 mm. Iyo PCB gomba dhayamita yekupinza kana kubvisa masiruu ekukwira inokurudzirwa pa10 ± 0.1 mm.
• For efficient production, a wave soldering process can be used to solder the terminals to the PCB. Each application, heat sink and PCB can be different; wave soldering must be evaluated on a case-by-case basis. In any case, a well-balanced layer of solder should surround each pin.
• The gap between the bottom of the PCB and the power module is 0.5 mm to 1 mm only as shown in PCB Mounted on Power Module figure. Using through-hole components on the PCB is not recommended.
• SP1F or SP3F pinout can change according to the configuration. See the product datasheet for more information on the pin-out location.

Power Module Mounting Mirayiridzo

• Kuiswa kwakaringana kwemodule base plate pane yekupisa sink kwakakosha kuti uve nechokwadi chekufambisa kupisa kwakanaka. Iyo inopisa sink uye iyo magetsi module yekubatanidza nzvimbo inofanirwa kuve yakati sandara (inokurudzirwa flatness inofanira kunge isingasviki 50 μm ye100 mm inoenderera, inokurudzirwa roughness Rz 10) uye yakachena (hapana tsvina, ngura, kana kukuvadzwa) kudzivirira mechanical kushushikana kana simba module rakaiswa, uye kudzivirira kuwedzera kwekupisa kwekudzivirira.
• Danho 1: Thermal grease application: Kuti uwane iyo yakaderera kesi yekupisa kunyura kwemafuta kuramba, yakatetepa girizi yemafuta inofanirwa kuiswa pakati pemagetsi module uye singi yekupisa. Zvinokurudzirwa kushandisa chidzitiro chekudhinda dhizaini kuti uve nechokwadi chekuisa yunifomu yehupamhi hudiki hwe60 μm (2.4 mils) pane singi yekupisa sezvakaratidzwa mumufananidzo unotevera. Iyo yekupisa inopindirana pakati peiyo module uye yekudziya sink inogonawo kugadzirwa nezvimwe conductive thermal interface zvinhu zvakaita sechikamu chekuchinja kombi (screen-yakadhindwa kana adhesive layer).
  
• Danho 2: Kuisa module yemagetsi pane sink yekupisa: Isa iyo module yemagetsi pamusoro pemakomba ekupisa uye isa diki kumanikidza kwairi. Isai M4 sikuruu nekiyi uye mawachi akafuratira mugomba rega rega rekukwira (a #8 screw inogona kushandiswa pachinzvimbo cheM4). Kureba kwesiruu kunofanirwa kunge kuri 12 mm (0.5”). Chekutanga, simbisa masiruu maviri ekusungirira. Shinga neimwe nzira kusvika kukosha kwetorque yawo yasvika (ona chigadzirwa chedata che torque inobvumirwa). Zvinokurudzirwa kushandisa screwdriver ine torque inodzorwa pakuita uku. Kana zvichiita, masiruru anogona kusimbiswa zvakare mushure memaawa matatu. Huwandu hudiki hwemagetsi hunenge huchionekwa hushoma hwemagetsi. kana yakabhaurirwa pasi pane singi yekupisa ine torque yakafanira yemodule inofanira kunge yakanyorova negirisi inodziya sezvakaratidzwa muGrezi paModule After Disssembling figure.

 General Assembly View

• Kana PCB yakakura ikashandiswa, mamwe ma spacers pakati pePCB uye sink yekupisa anodiwa. Zvinokurudzirwa kuchengeta chinhambwe chingangoita 5 cm pakati pemagetsi module uye spacers sezvakaratidzwa mumufananidzo unotevera. Iwo ma spacers anofanirwa kunge akareba zvakafanana neakamira (12 ± 0.1 mm).
  
• Kune chaiwo maapplication, mamwe maSP1F kana SP3F emagetsi module anogadzirwa neAlSiC (Aluminium Silicon Carbide) baseplate (M suffix muchikamu chenhamba). AlSiC baseplate ndeye 0.5 mm kukora kupfuura baseplate yemhangura, saka ma spacers anofanirwa kunge ari 12.5 ± 0.1 mm mukukora.
• Iyo SP1F uye SP3F yepurasitiki furemu kureba kwakafanana kureba seSOT-227. PaPCB imwechete, kana SOT-227 uye imwe kana akati wandei SP1F/SP3F mamodules emagetsi ane copper baseplate akashandiswa, uye kana kureba pakati pemamodule maviri emagetsi isingapfuure masendimita mashanu, hazvifanirwe kuisa spacer sezvakaratidzwa mumufananidzo unotevera.
• Kana SP1F/SP3F mamodule emagetsi ane AlSiC baseplate akashandiswa neSOT-227 kana mamwe maSP1F/SP3F modules ane copper baseplate, kureba kweheatsink kunofanirwa kudzikiswa ne0.5 mm pasi peSP1F/SP3F modules ine AlSiC baseplate kuchengetedza ese mamodule standoffs pahurefu hwakafanana.
• Kuchengetedza kunofanirwa kutorwa nezvinhu zvinorema senge electrolytic kana polypropylene capacitors, transformers, kana inductors. Kana zvikamu izvi zviri munzvimbo imwe chete, zvinokurudzirwa kuwedzera spacers kunyange kana kureba pakati pema modules maviri haapfuuri 5 cm zvakadai, uremu hwezvikamu izvi pabhodhi hahubatiki nemagetsi emagetsi asi nema spacers. Chero zvazvingava, imwe neimwe application, kupisa singi, uye PCB zvakasiyana; iyo spacers kuiswa kunofanirwa kuongororwa pane imwe nyaya-ne-kesi hwaro.
  

Power Module Dismounting Instructions

To safely remove the power module from the heatsink, perform following steps:

1. On the PCB, remove all screws from the spacers.
2. On the heatsink, remove all screws from the power module mounting holes.
   Kuchenjerera
   Depending on the thermal interface material, the module baseplates may adhere strongly to the heatsink. Do not pull on the PCB to remove the assembly, as this may damage the PCB or the modules. To prevent damage, detach each module from the heatsink before removal.
3. To safely detach the modules:
   • Insert a thin blade, such as the tip of a flat screwdriver, between the module baseplate and the heatsink.
   • Gently twist the blade to separate the baseplate from the heatsink.
   • Repeat this process for each module mounted to the PCB.

Mhedziso
This application note gives the main recommendations regarding the mounting of SP1F or SP3F modules. Applying these instructions helps decrease the mechanical stress on PCB and power module, while ensuring long term operation of the system. Mounting instructions to the heatsink must also be followed to achieve the lowest thermal resistance from the power chips down to the cooler. All these steps are essential to guarantee the best system reliability.

Revision History
Nhoroondo yekudzokorora inotsanangura shanduko dzakaitwa mugwaro. Kuchinja kwacho kunorongwa nekudzokorora, kutanga nebhuku razvino uno.

Kudzokorora	Date	Tsanangudzo
B	10/2025	Added Power Module Dismounting Instructions.
A	05/2020	Uku ndiko kutanga kuburitswa kwegwaro iri.

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FAQ

Can I use a wave soldering process for soldering terminals to the PCB?

Yes, a wave soldering process can be used for efficient production. However, evaluate its suitability based on your specific application, heat sink, and PCB requirements.

Is it necessary to install a spacer between power modules?

If the distance between two power modules does not exceed 5 cm and they are mounted on the same PCB with a SOT-227, it is not necessary to install a spacer.

Zvinyorwa / Zvishandiso

MICROCHIP SP1F, SP3F Power Module [pdf] Bhuku reMirayiridzo SP1F, SP3F, AN3500, SP1F SP3F Power Module, SP1F SP3F, Power Module, Module

References

• User Manual