onimi SiC E1B Modules Mushandisi Gwaro

Scope

onsemi akapayona kuunzwa kweSiC JFETs mukugadziriswa kwekasikodhi ine gedhi drive inoenderana neSi MOSFETs, IGBTs, uye SiC MOSFETs, zvichibva pa5 V chikumbaridzo vol.tage uye yakafara gedhi rekushandisa renji re ± 25 V.

Aya maturusi ari masikirwo anokurumidza kukurumidza kuchinja, ane yakanakisa diode yemuviri maitiro. onsmi akabatanidza advantageous SiC JFET yakavakirwa simba mudziyo ine indasitiri yakajairwa magetsi module package, E1B, kuti iwedzere kuwedzera simba density, kunyatsoita, mutengo-kushanda, uye nyore kushandisa kwemaindasitiri emagetsi masisitimu.

Ichi chinyorwa chekushandisa chinounza nhungamiro yekukwira (PCB uye heatsink) yeasemi yazvino E1B magetsi module mapakeji (hafu-bhiriji uye yakazara bhiriji).

ZVINOKOSHA: Snubbers inokurudzirwa zvakanyanya kune SiC E1B modules nekuda kweiyo intrinsic inokurumidza-kuchinja kumhanya. Zvakare, snubber inoderedza zvakanyanya kudzima-kudzima kushandura kurasikirwa kuita SiC E1B modules inoyevedza zvakanyanya muZVS (zero vol.tage turn-on) zvinyoro-zvinoshandura zvikumbiro senge phase-shifted yakazara-bhiriji (PSFB), LLC, nezvimwe.

Ichi chigadzirwa chinokurudzirwa kuti chishandiswe ne solder pin attach uye phase change thermal interface zvinhu, uye hazvikurudzirwe kuti zviitwe uchishandisa press fit uye kushandisa thermal girisi. Ndokumbira utarise kumirayiridzo yekumisikidza uye magwaro egwaro remushandisi ane chekuita nechigadzirwa ichi kuti uwane ruzivo rwakadzama.

Ichi chinyorwa chekunyorera chinopawo zvinongedzo zvekushandisa kune ekufananidza modhi, nhungamiro yegungano, hunhu hwekupisa, kuvimbika, uye magwaro ekufanirwa.

Resource uye Reference

1. SiC E1B Modules Technical Overview
2. SiC E1B Modules Mounting Guideline
3. SiC Cascode JFET & Module User Guide
4. SiC E1B Modules DPT EVB User Guide
5. kutanga SiC Module Link: SiC Modules
6. EliteSiC Simba Simulator
7. onsemi SiC power solution yepakati hub
8. Mavambo eSiC JFETs uye Evolution Yavo Kuenda kune Yakakwana Switch

E1B Module Ruzivo

Chikonzero chikuru chesimba semiconductor module kutadza kukwira zvisina kunaka. Kusakwira zvakanaka kunokonzeresa tembiricha yakakwira kana yakawandisa, iyo inodzikamisa zvakanyanya kushanda kwehupenyu hwemodule. Nekuda kweizvozvo, kuisirwa kwakakodzera module kwakakosha kuti uwane yakavimbika kupisa kutamisa kubva kuSiC mudziyo junction kuenda kuchiteshi chekutonhora.

Iwo E1B modules akagadzirwa kuti atengeswe kune akadhindwa redunhu bhodhi (PCB) uye anonamirwa kune inopisa sink ine pre-yakaunganidzwa screws uye washer, sezvakaratidzwa mu. Mufananidzo 1 uye Mufananidzo 2. Rumwe ruzivo rwakakura pamusoro pezviyero uye kushivirira kwekugadzira Hardware yeaya masisitimu anogona kuwanikwa mune module madheti.

Mufananidzo 1. Module Mounting Screw Nzvimbo (Pamusoro View)

AND90340/D

Mufananidzo 2. Module Mounting nePCB uye Heatsink (Assembly Exploded View)

Inokurudzirwa Mounting Sequence

onsemi inokurudzira kutevedzera kukwira kwekuita zvirinani kupisa uye hupenyu hweSiC E1B module:

1. Solder pini yemodule kuPrinted Circuit Board (PCB)
2. Isa PCB pane module
3. Isa iyo module kune inopisa sink

Iine pre-assembled screw (combine screw, washer, uye lock washer), sunga module pane singi yekupisa uchishandisa inomisa torque. Izvo zvinofanirwa kucherechedzwa kuti saizi uye pamusoro peheatsink inofanirwa kutariswa mukati mekutengesa, seyakakodzera kupisa kupisa pakati pemodule kumashure uye heatsink interface yakakosha pakuita kwese kwepakeji muhurongwa (ona Mufananidzo 2).

1. Solder iyo Module Pin kuPCB
   Mapini Anotengeswa anoshandiswa paE1B module akatariswa uye akakodzerwa neonsemi kune akajairwa FR4 PCBs.
   Kana iyo PCB ichida reflow soldering process yezvimwe zvikamu, zvinokurudzirwa kuti udzorere PCB usati waisa module kuti udzivise kuratidzwa kune yakanyanya tembiricha.

Yakajairika wave soldering profile inoratidzwa muMufananidzo 4 uye Tafura 1.
Kana mamwe maitiro ekubata akashandiswa mukugadzira akadhindwa edunhu mabhodhi, kumwe kuedzwa, kuongorora, uye chitupa kunodiwa.

PCB Chinodiwa
FR4 PCB nehupamhi hwepamusoro hwe2 mm.
Tarisa kuIEC 61249−2-7:2002 kutarisa kana PCB zvinhu zvichisangana nezvinodiwa.
Mushandisi kuti aone iwo akanakisa conductive akaturikidzana ekwakakodzera dhizaini yePCB stack layer asi inoda kuve nechokwadi kuti akawanda layer PCBs anotevera IEC 60249-2-11 kana IEC 60249-2-1.
Kana mutengi achifunga akapetwa-mativi maPCB tarisa kuIEC 60249-2-4 kana IEC 60249-2-5

Solder Pin Inodiwa
Zvinhu zvakakosha zvekuwana majoini ekutengesa ane kuvimbika kwakanyanya ndeye PCB dhizaini.
Iyo yakaputirwa-kuburikidza negomba madhayamita paPCB inofanirwa kugadzirwa zvinoenderana neiyo solder pini dimension. (ona Mufananidzo 3).

AND90340
Kana iyo PCB gomba dhizaini isiriyo, matambudziko anogona kuitika anogona kuitika.
Kana iyo dhayamita yekupedzisira yegomba iri diki zvakanyanya, inogona kunge isina kuiswa zvakanaka uye ichaita kuti mapini atyoke nekukuvadza PCB.
Kana iyo yekupedzisira gomba dhayamita yakakurisa, inogona kusakonzeresa kuita kwakanaka kwemichini uye magetsi mushure mekutengesa. Solder mhando inofanirwa kureva IPC-A-610.
Iwo akakurudzirwa ma paramita e wave soldering process tembiricha profiles inobva pa IPC-7530, IPC-9502, IEC 61760-1: 2006.

Mufananidzo 3. Module Mounting kuPCB Isati Yakwira kune Heat Sink

Mufananidzo 4. Typical Wave Soldering Profile (Chiverengo EN 61760-1:2006)

Tafura 1. TYPICAL WAVE SOLDERING PROFILE (Chiverengo EN 61760-1:2006)

Profile Feature		Standard SnPb Solder	Kutungamira (Pb) Yemahara Solder
Preheat	Tembiricha min. (Tsmin)	100 °C	100 °C
	Tembiricha yemhando. (Tstyp)	120 °C	120 °C
	Tembiricha max. (Tsmax)	130 °C	130 °C
	Tembiricha max. (Tsmax)	70 seconds	70 seconds
Δ Preheat kusvika max. Tembiricha		150 °C hukuru.	150 °C hukuru.
D Preheat to max. Tembiricha		235 °C − 260 °C	250 °C − 260 °C
Nguva iri paPeak Temperature (tp)		10 seconds max5 seconds max imwe neimwe wave	10 seconds max5 seconds max imwe neimwe wave
Ramp-pasi Rate		~ 2 K/s min ~ 3.5 K/s typ ~5 K/s max	~ 2 K/s min ~ 3.5 K/s typ ~5 K/s max
Nguva 25 °C kusvika 25 °C		4 kwemaminitsi	4 kwemaminitsi

Kuisa PCB paModule

Kana iyo PCB inotengeswa yakananga pamusoro peiyo module, iyo mechanical stress iripo kunyanya pane solder joint. Kuti uderedze kushushikana uku, imwe screw inogona kushandiswa kugadzirisa PCB mune ina standoffs yemodule, ona Mufananidzo 5.
Iwo ma modules anowirirana ne-self-tapping screws (M2.5 x L (mm)), zvichienderana nePCB ukobvu.

Kureba kweshinda inopinda mugomba rekumira kunofanirwa kunge kune hushoma hweLmin 4 mm uye hurefu hweLmax 8 mm. Inokurudzirwa kushandisa elektroniki inodzorwa screwdriver kana yemagetsi screwdriver kuti ive nechokwadi chiri nani.


Mufananidzo 5. PCB Kukwira paE1B Module: (a) E1B PCB Mounting Hole ine Standoff, uye (b) Maximum Screw Thread Engagement Depth.

PCB Mounting Chinodiwa
Iyo standoff maburi kudzika kwe 1.5 mm inoshanda se screw entry guide chete uye haifanirwe kushandisa chero simba.

Chinhu chakakosha huwandu hwe torque inobvumidzwa kune pre-kusimbisa uye kuomesa maitiro:

• Pre-kusimbisa = 0.2 ~ 0.3 Nm
• Kuomesa = 0.5 Nm Max

Mufananidzo.

Kukwidza Module kune Heatsink

Heatsink Chinodiwa
Mamiriro ekunze eheatsink chinhu chakakosha pane yese kupisa sisitimu yekupisa uye inofanirwa kunge yakabatana zvizere neheatsink. Iyo module substrate pamusoro uye yekupisa inonyura pamusoro inofanira kunge yakafanana, yakachena, uye isina kusvibiswa isati yakwira. Izvi ndezvekudzivirira voids, kudzikisira iyo thermal impedance uye kuwedzera huwandu hwesimba hunogona kuraswa mukati memodule uye kuwana chinongedzo chekushisa kuramba zvichibva pane database. Hunhu hweheatsink hwepamusoro hunodiwa kuti uwane yakanaka yekupisa conductivity sepaDIN 4768−1.

• Hushasha (Rz): ≤10 m
• Kudzikama kweheatsink kunoenderana nehurefu hwe100 mm: ≤50 m

Thermal Interface Material (TIM)
Thermal interface zvinhu zvinoshandiswa pakati pemodule kesi uye heatsink kiyi yekuwana yakavimbika uye yepamusoro-yemhando yekupisa kuita. Kupisa girisi kana kupisa paste hazvikurudzirwe kune baseplate-shoma module senge E1B.
Pasina yakakora yemhangura baseplate inoshanda seanoparadzira kupisa, iyo yekupisa girisi pombi-kunze mhedzisiro (nekupisa kwekuwedzera uye kuputika kweTIM layer pakati pemodule kesi uye heatsink panguva yemagetsi bhasikoro kana tembiricha bhasikoro) inowedzera kuumbwa kwechinhu muTIM layer uye ine yakakosha kukanganisa pamagetsi bhasikoro hupenyu hwese module.

Pane kudaro, TIM uchishandisa chikamu chekuchinja zvinhu inokurudzirwa zvakanyanya kune E1B modules. Mufananidzo wechinomwe unoratidza simba rebhasikoro mhedzisiro ye7 V 1200 A half-bridge module (UHB100SC100E12BC1N) uchishandisa nzira mbiri dzakasiyana, thermal grease vs phase change material. Iyo horizontal axis inoratidza huwandu hwema cycles. Axis yakatwasuka inoratidza mudziyo VDS panguva yeTj_rise pa3 °C. Iyo red curve inoratidza simba bhasikoro nemafuta ekupisa. Iyo yebhuruu curve inoratidza simba cycling ine phase shanduko zvinhu. Iyo dzvuku curve inogona chete kuenda kugumi nembiri,100 kutenderera kusati kwatiza kupisa kwakaitika nekuda kwekudzikisira kwekupisa kwemafuta kubva pakupisa girisi pombi-kunze maitiro. Kune imwecheteyo E12,000B module uchishandisa chikamu shanduko zvinhu zveheatsink TIM inovandudza zvakanyanya simba bhasikoro kupfuura 1 mitsetse.

Mufananidzo 8 unoratidza simba rekuita bhasikoro bvunzo mamiriro uye kuseta Mufananidzo 7. E1B Module Power Cycling Performance ine Yakasiyana TIM yeHeatsink: Thermal Grease vs Phase Shanduko Material

Mufananidzo 8. E1B Module Power Cycling Test (a) Setup, uye (b) Test Conditions

Gadzirira	Tsanangudzo
DUT	UHB100SC12E1BC3N
Heating nzira	Constant DC ikozvino
Tj simuka	100 °C
Mvura inotonhorera yekupisa tembiricha	20 °C
Kupisa nguva painotenderera	5 p
Nguva yekutonhodza pane imwe neimwe	26 p
TIM (chikamu shanduko)	Laird TPCM 7200

Kazhinji, mushure mekumisikidzwa kwemuchina, chikamu chekuchinja zvinhu chinofanirwa kubikwa muovheni kubvumira TIM kuti ichinje chikamu chayo kuti iwedzere kuzadza microscopic voids pakati pemodule kesi uye heatsink uye kuderedza kupisa kwekupisa kubva module kesi kuenda heatsink. Mu exampLe inoratidzwa muFigure 7 neFigure 8, kupisa kwekupisa kubva panosangana mudziyo kuenda kumvura kunodzikiswa kubva pa0.52 °C/W kuenda pa0.42 °C/W mushure meawa imwe uchibika pa1 °C. Ndokumbira ubvunze mutengesi weTIM kuti uwane mirairo yakazara.

CHERECHEDZA: Chero chikamu chakasiyana chekuchinja mhando yemhando inofanirwa kuongororwa uye kuyedzwa zvakare nemutengi nekutevera mirairo kubva kune TIM (chikamu chekuchinja zvinhu) mutengesi kuti ive nechokwadi chekuita kwakakwana.

Kukwidza Module kune Heatsink
Iyo yekumisikidza maitiro zvakare chinhu chakakosha kuvimbisa kubata kunoshanda kwemodule uye heatsink ine chikamu chekuchinja zvinhu pakati. Ziva kuti heatsink uye module haifanire kubata munzvimbo yese kudzivirira kupatsanurwa kwenzvimbo pakati pezvikamu zviviri izvi. Tafura 2 inopfupisa kukwira nhungamiro yeheatsink yekunamatira.

Tafura 2. qalami SiC E1B MODULE HEATSINK MOUNTING RUDZIDZO

Heatsink Mounting	Tsanangudzo
Sikuru saizi	M4
Screw type	DIN 7984 (ISO 14580) flat socket musoro
Kudzika kwe screw mu heatsink	> 6 mm
Spring lock washer	DIN 128
Flat washer	DIN 433 (ISO 7092)
Mounting torque	0.8Nm kusvika 1.2Nm
TIM	Ndapota shandura zvinhu, zvakadai seLaird Tpcm

Mamwe Mafungiro Ekuwedzera

Iyo yakazara sisitimu yemodule yakaiswa inofanirwa kutariswa. Kana iyo module yakanyatsobatanidzwa kune inopisa sink uye bhodhi redunhu, kushanda kwese kwechigadzirwa kuchawanikwa.
Matanho akakodzera anofanirwa kutorwa kuderedza vibration zvakare sezvo PCB inotengeswa chete kune module.
Mitezo isina simba yakatengeswa inofanira kudzivirirwa. Mapini ega ega anogona kungotakurwa perpendicular kune yekupisa singi nekunyanya kudzvanywa, kushushikana, uye yakaringana chinhambwe pakati pePCB uye heatsink inoda kuongororwa nekushandisa kwemutengi.

Kuti uderedze kushushikana kwemagetsi paPCB uye module, kunyanya kana PCB iine chinorema chinokurudzirwa kushandisa nzvimbo post, ona Mufananidzo 9.

Mufananidzo 9. E1B Module PCB uye Heatsink Mounting ne Space Post

Iyo yakakurudzirwa dimension (X) pakati penzvimbo yepasi uye kumucheto kwePCB inokwirisa gomba i ≤ 50 mm.
Kana mamodule akawanda akaiswa paPCB imwechete, kureba kusiyanisa pakati pemamodules kunogona kukonzera kushushikana kwemagetsi pane solder joint. Kuti uderedze kushushikana, kureba kwakakurudzirwa (H) kwenzvimbo yenzvimbo ndeye 12.10 (±0.10) mm.

Clearance uye Creepage Chinodiwa

Iyo mechanical spacing yegungano pakati pemodule nePCB inofanira kusangana nemvumo uye creepage kureba kunodiwa neIEC 60664-1 Revision 3. Mufananidzo 10 unoratidza mufananidzo.
Iyo diki clearance ndiyo chinhambwe pakati pescrew musoro uye pasi pepamusoro pePCB inofanirwa kunge iine chinhambwe chakaringana kudzivirira kufambiswa kwemagetsi munzvimbo iyi.
Neimwe nzira, mamwe matanho ekudzivirira, akadai sePCB slot, kukoira kana kubikira kwakakosha kungangoda kuitwa kuti isangane nemvumo yakakodzera uye creepage kureba zviyero.

Mufananidzo 10. Kuchenesa pakati peScrew nePCB

Iyo screw type inotaridza iyo shoma clearance gap pakati payo nePCB. Iine pani yemusoro sikururu zvinoenderana neISO7045, yekukiya washer zvinoenderana neDIN 127B uye flat washer DIN 125A, uye cl.amp iyo inoratidzwa muMufananidzo 10, chinhambwe chichava 4.25 mm. Yakajairika clearance uye creepage inowanikwa mune dhetabheti. Rumwe ruzivo nezve module clearance kana creepage chinhambwe chinogona kubata rutsigiro rwekushandisa kana kutengesa uye kushambadzira.

Mazita ese emhando uye mazita echigadzirwa anoonekwa mugwaro iri maregisheni akanyoreswa kana matrademark evaridzi vavo.

vosemi, , uye mamwe mazita, mamakisi, uye mhando zvakanyoreswa uye/kana zvakajairwa mutemo zviratidzo zveSemiconductor Components Industries, LLC dba. "onsemi" kana vanobatana nayo uye/kana vatsigiri muUnited States uye/kana dzimwe nyika. onsemi ane kodzero dzehuwandu hwematendi, zviratidzo, kodzero dzekodzero, zvakavanzika zvekutengeserana, uye zvimwe zvinhu zvenjere.
Kurongwa kwe zvosemi's chigadzirwa / patent yekuvhara inogona kuwanikwa pa www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi inochengetera kodzero yekuchinja chero nguva kune chero zvigadzirwa kana ruzivo rwuri pano, pasina chiziviso. Ruzivo rwuri pano rwunopihwa “as-is” uye onsemi haigadzirise waranti, chinomiririra kana vimbiso maererano nekurongeka kweruzivo, maficha echigadzirwa, kuwanikwa, kushanda, kana kukodzera kwezvigadzirwa zvayo kune chero chinangwa, uye hazviite. onsemi tora chero mhosva inomuka kubva mukushandisa kana kushandiswa kwechero chigadzirwa kana dunhu, uye inorambisisa chero uye yese mhosva, kusanganisira pasina muganho wakakosha, unokonzeresa kana kukuvara kwakaitika. Mutengi ane mutoro kune zvigadzirwa zvayo uye maapplication anoshandisa onsemi zvigadzirwa, kusanganisira kutevedzera mitemo yese, mirau uye kuchengetedza zvinodiwa kana zviyero, zvisinei nerutsigiro kana ruzivo rwemashandisirwo rwunopihwa onsemi. "Yakajairika" maparameter anogona kupihwa mukati onsemi data sheets uye/kana zvakatemwa zvinogona uye zvinosiyana mumashandisirwo akasiyana uye kuita chaiko kunogona kusiyana nekufamba kwenguva. Ese ma parameter anoshanda, anosanganisira "Typicals" anofanirwa kusimbiswa kune yega yega mutengi application nehunyanzvi hwevatengi. onsemi haipe chero rezinesi pasi pekodzero dzayo dzepfuma kana kodzero dzevamwe. onsemi zvigadzirwa hazvina kugadzirwa, zvakanangwa, kana kupihwa mvumo yekushandisa sechinhu chakakosha mumasisitimu ekutsigira hupenyu kana chero FDA Kirasi 3 michina yekurapa kana michina yekurapa ine yakafanana kana yakafanana kupatsanurwa munzvimbo yekunze kana chero zvishandiso zvakagadzirirwa kuisirwa mumuviri wemunhu. Mutengi anofanira kutenga kana kushandisa onsemi zvigadzirwa zvechero zvazvisingatarisirwe kana zvisina mvumo application, Mutengi achabvisa uye kubata onsemi uye maofficial ayo, vashandi, vatsigiri, vanobatana, uye vagovani vasina mhosva kune zvese zvichemo, mutengo, kukuvadzwa, uye mari, uye inonzwisisika muripo wemagweta unobva, zvakananga kana zvisina kunanga, chero chirevo chekukuvara kwemunhu kana kufa kunoenderana nekushandiswa kusingatarisirwi kana kusingabvumirwe. , kunyange kana kutaura kwakadaro kuchireva izvozvo onsemi akanga asina hanya nekugadzirwa kana kugadzirwa kwechikamu chacho. onsemi Mukana Wakaenzana/Affirmative Action Employer. Mabhuku aya ari pasi pemitemo yese yekodzero dzekodzero uye haatengeswizve neimwe nzira.

RUDZIDZO RWEKUWEDZERA

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Zvinyorwa / Zvishandiso

onsemi SiC E1B Modules [pdf] Bhuku reMushandisi AND90340-D, SiC E1B Modules, SiC E1B, Modules

References

• User Manual